ISTFA 2027

About International Symposium for Testing and Failure Analysis

International Symposium for Testing and Failure Analysis is electronics testing and failure-analysis symposium focused on semiconductor and electronics testing, fault isolation, microscopy, sample preparation, packaging analysis, diagnostics and reliability learning. The 2027 edition runs from 31 October-4 November 2027 at Phoenix venue to be confirmed in Phoenix, United States. Its fault isolation and diagnostics programme combines specialist knowledge with opportunities to compare technologies, methods and suppliers. This International Symposium for Testing and Failure Analysis edition is not presented as a space-only meeting, so teams should select the sessions and exhibitors that match a defined need.

The reason for including it in Arc’s space-engineering calendar is specific: root-cause analysis of flight electronics, package and die investigation, counterfeit detection, diagnostic readiness and evidence-led reliability improvement. Those fault isolation and diagnostics capabilities often sit below mission-level requirements but materially affect whether flight hardware can be designed, produced, verified and supported with defensible evidence. Space teams can therefore use International Symposium for Testing and Failure Analysis to investigate technical options, meet relevant specialists and understand adjacent-industry practices without assuming that every part of the programme applies to spacecraft development.

Event history and organiser

The International Symposium for Testing and Failure Analysis is ASM International’s specialist forum for electronic-device analysis and diagnostic practice. The series combines technical presentations with an exposition of tools and services used to isolate faults and understand physical failure mechanisms. ASM International publishes the current International Symposium for Testing and Failure Analysis information and remains the authoritative source for dates, venue, programme and access arrangements. Arc reviewed its fault isolation and diagnostics material on 31 August 2026 and separated confirmed edition facts from broader descriptions of the recurring event. Previous-edition information explains the International Symposium for Testing and Failure Analysis series and typical format, but it should not be used to infer an unannounced speaker, exhibitor, deadline or activity for 2027. This International Symposium for Testing and Failure Analysis guide links directly to the official sources and records its review date so readers can identify what may have changed before they register or travel. Readers should recheck details whenever the organiser publishes a later update.

Topics and themes

The official fault isolation and diagnostics scope is broader than space, but the following subjects have a direct connection to spacecraft engineering. Readers should use the live International Symposium for Testing and Failure Analysis programme to confirm the depth and timing of each subject.

• Fault isolation and diagnostics: the programme helps space electronics failure analysts examine this subject against current engineering tools, methods and supplier capability.
• Package and die analysis: the programme helps space electronics failure analysts examine this subject against current engineering tools, methods and supplier capability.
• Microscopy and sample preparation: the programme helps space electronics failure analysts examine this subject against current engineering tools, methods and supplier capability.
• Power and advanced devices: the programme helps space electronics failure analysts examine this subject against current engineering tools, methods and supplier capability.
• Hardware security and counterfeit detection: the programme helps space electronics failure analysts examine this subject against current engineering tools, methods and supplier capability.

Who should attend?

International Symposium for Testing and Failure Analysis is most relevant to Space electronics failure analysts, Component assurance engineers, Reliability teams, Laboratory and microscopy specialists, Hardware security practitioners when they have a defined technical or assurance question to investigate. Programme managers and systems engineers may benefit when a fault isolation and diagnostics decision crosses requirements, design, manufacture, verification and supplier evidence. It is less useful for general space networking because it is electronics testing and failure-analysis symposium. Before attending International Symposium for Testing and Failure Analysis, teams should review the programme and exhibitor information, identify relevant spacecraft work packages, and arrange focused conversations around qualification constraints, evidence needs, interfaces and lifecycle risk. Colleagues should agree International Symposium for Testing and Failure Analysis outcomes before making travel or registration commitments.

Practical information

International Symposium for Testing and Failure Analysis is listed for 31 October-4 November 2027 at Phoenix venue to be confirmed, Phoenix. Check the official fault isolation and diagnostics event page immediately before booking for registration, opening times, programme changes and travel guidance. Arc is not the organiser and cannot confirm places. Space teams should shortlist International Symposium for Testing and Failure Analysis sessions or suppliers in advance and avoid treating exhibition claims as proof that a product is flight qualified.