SEMICON Europa 2026

About SEMICON Europa

SEMICON Europa is semiconductor conference and exhibition focused on European semiconductor manufacturing, advanced packaging, fab management, MEMS, imaging sensors, standards and resilient supply chains. The 2026 edition runs from 10-13 November 2026 at Messe München in Munich, Germany. Its advanced packaging programme combines specialist knowledge with opportunities to compare technologies, methods and suppliers. This SEMICON Europa edition is not presented as a space-only meeting, so teams should select the sessions and exhibitors that match a defined need.

The reason for including it in Arc’s space-engineering calendar is specific: European access to qualified components, advanced packaging, imaging sensors, manufacturing standards and strategic semiconductor supply chains. Those advanced packaging capabilities often sit below mission-level requirements but materially affect whether flight hardware can be designed, produced, verified and supported with defensible evidence. Space teams can therefore use SEMICON Europa to investigate technical options, meet relevant specialists and understand adjacent-industry practices without assuming that every part of the programme applies to spacecraft development.

Event history and organiser

SEMICON Europa is SEMI Europe’s principal regional event for semiconductor manufacturing and technology. The 2026 edition is co-located with electronica at Messe München, giving visitors access to both events while retaining a distinct semiconductor programme and exhibition identity. SEMI Europe and Messe München publishes the current SEMICON Europa information and remains the authoritative source for dates, venue, programme and access arrangements. Arc reviewed its advanced packaging material on 31 August 2026 and separated confirmed edition facts from broader descriptions of the recurring event. Previous-edition information explains the SEMICON Europa series and typical format, but it should not be used to infer an unannounced speaker, exhibitor, deadline or activity for 2026. This SEMICON Europa guide links directly to the official sources and records its review date so readers can identify what may have changed before they register or travel. Readers should recheck details whenever the organiser publishes a later update.

Topics and themes

The official advanced packaging scope is broader than space, but the following subjects have a direct connection to spacecraft engineering. Readers should use the live SEMICON Europa programme to confirm the depth and timing of each subject.

• Advanced packaging: the programme helps space electronics engineers examine this subject against current engineering tools, methods and supplier capability.
• Fab management and manufacturing: the programme helps space electronics engineers examine this subject against current engineering tools, methods and supplier capability.
• MEMS and imaging sensors: the programme helps space electronics engineers examine this subject against current engineering tools, methods and supplier capability.
• Semiconductor standards: the programme helps space electronics engineers examine this subject against current engineering tools, methods and supplier capability.
• European supply-chain resilience: the programme helps space electronics engineers examine this subject against current engineering tools, methods and supplier capability.

Who should attend?

SEMICON Europa is most relevant to Space electronics engineers, Sensor and payload developers, Component assurance teams, Packaging and manufacturing specialists, European technology suppliers when they have a defined technical or assurance question to investigate. Programme managers and systems engineers may benefit when a advanced packaging decision crosses requirements, design, manufacture, verification and supplier evidence. It is less useful for general space networking because it is semiconductor conference and exhibition. Before attending SEMICON Europa, teams should review the programme and exhibitor information, identify relevant spacecraft work packages, and arrange focused conversations around qualification constraints, evidence needs, interfaces and lifecycle risk. Colleagues should agree SEMICON Europa outcomes before making travel or registration commitments.

Practical information

SEMICON Europa is listed for 10-13 November 2026 at Messe München, Munich. Check the official advanced packaging event page immediately before booking for registration, opening times, programme changes and travel guidance. Arc is not the organiser and cannot confirm places. Space teams should shortlist SEMICON Europa sessions or suppliers in advance and avoid treating exhibition claims as proof that a product is flight qualified.